cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 1/6 BC517A3 cystek product specification general purpose npn epitaxial planar transistor BC517A3 description ? the BC517A3 is a darlington amplifier transistor ? pb-free package symbol outline BC517A3 to-92 c b e b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 40 v collector-emitter voltage v ceo 30 v emitter-base voltage v ebo 10 v collector current i c 0.5 a power dissipation pd 625 mw junction temperature tj 150 c storage temperature tstg -55~+150 c
cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 2/6 BC517A3 cystek product specification characteristics (ta=25c) symbol min. typ. max. unit test conditions bv cbo 40 - - v i c =100 a bv ceo 30 - - v i c =1ma bv ebo 10 - - v i e =100 a i cbo - - 100 na v cb =40v i ebo - - 100 na v eb =10v *v ce(sat) - - 1.0 v i c =100ma, i b =1ma *v ce(sat) - - 1.3 v i c =100ma, i b =0.1ma *v be(sat) - 1.5 2.0 v i c =100ma, i b =1ma *v be(on) - - 2.0 v v ce =5v, i c =100ma *h fe 1 10k - - v ce =5v, i c =10ma *h fe 2 20k - - v ce =5v, i c =100ma f t - 220 - mhz v ce =2v, i c =100ma, f=100mhz cob - 5 - pf v cb =10v, f=1mhz *pulse test: pulse width 380 s, duty cycle 2% ordering information device package shipping marking BC517A3 to-92 (pb-free) 2000 pcs / tape & box bc517
cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 3/6 BC517A3 cystek product specification characteristic curves current gain vs collector current 1000 10000 100000 1 10 100 1000 collector current---ic(ma) current gain--- hfe hfe@vce=5v saturation voltage vs collector current 100 1000 10000 1 10 100 1000 collector current ---ic(ma) saturation voltage---(mv) vce(sat)@ic=1000ib saturation voltage vs collector current 1000 10000 1 10 100 1000 collector current ---ic(ma) saturation voltage---(mv) vbe(sat)@ic=1000ib on voltage vs collector current 100 1000 10000 0.1 1 10 100 1000 collector current ---ic(ma) on voltage --- (mv) vbe(on)@vce=5v cutoff frequency vs collector current 0.1 1 1 10 100 collector current---ic(ma) cutoff frequency---ft(ghz) ft@vce=5v power derating curve 0 100 200 300 400 500 600 700 0 50 100 150 200 ambient temperature ---ta( ) power dissipation---pd(mw)
cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 4/6 BC517A3 cystek product specification to-92 taping outline millimeters dim item min. max. a component body height 4.33 4.83 d tape feed diameter 3.80 4.20 d1 h2a h2a h2 h2 d2 a h w w1 h3 h4 h1 l1 l p2 p p1 f1 f2 d1 d t2 t t1 lead diameter 0.36 0.53 d2 component body diameter 4.33 4.83 f1,f2 component lead pitch 2.40 2.90 f1,f2 f1-f2 - 0.3 h height of seating plane 15.50 16.50 h1 feed hole location 8.50 9.50 h2 front to rear deflection - 1 h2a deflection left or right - 1 h3 component height - 27 h4 feed hole to bottom of component - 21 l lead length after component removal - 11 l1 lead wire enclosure 2.50 - p feed hole pitch 12.50 12.90 p1 center of seating plane location 5.95 6.75 p2 4 feed hole pitch 50.30 51.30 t over all tape thickness - 0.55 t1 total taped package thickness - 1.42 t2 carrier tape thickness 0.36 0.68 w tape width 17.50 19.00 w1 adhesive tape width 5.00 7.00 - 20 pcs pitch 253 255
cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 5/6 BC517A3 cystek product specification to-92 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - * 0.1000 - * 2.54 c 0.5000 - 12.70 - i - * 0.0500 - * 1.27 d 0.0142 0.0220 0.36 0.56 1 - * 5 - * 5 e - * 0.0500 - * 1.27 2 - * 2 - * 2 f 0.1323 0.1480 3.36 3.76 3 - * 2 - * 2 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: 42 alloy ; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 recommended storage condition ? temperature : 10 ~ 35 c ? humidity : 30 ~ 60 %rh recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds bc517 marking: 3 1 a d b c i 1 e f 2 2 3 h g s t yle: pin 1.collec t or 2.bas e 3.emitter 3-lead t o -92 plastic package cy s t ek p a cka g e code: a 3
cystech electronics corp. spec. no. : c214a3-a issued date : 2007.06.25 revised date : page no. : 6/6 BC517A3 cystek product specification recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds 183 c 60-150 seconds time maintained above: ? temperature (t l ) 217 c ? time (t l ) 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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